Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| Главный автор: | |
|---|---|
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| Формат: | Электронный ресурс eКнига |
| Язык: | английский |
| Опубликовано: |
Hoboken, N.J. :
Wiley,
2011.
|
| Предметы: | |
| Online-ссылка: | An electronic book accessible through the World Wide Web; click to view |
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