Micro-manufacturing design and manufacturing of micro-products /
"This book is the first of its kind to collectively address design-based and mechanical micro-manufacturing topics in one place. It focuses on design and materials selection, as well as the manufacturing of micro-products using mechanical-based micro-manufacturing process technologies. After ad...
保存先:
| 団体著者: | |
|---|---|
| その他の著者: | , |
| フォーマット: | 電子媒体 eBook |
| 言語: | 英語 |
| 出版事項: |
Hoboken, N.J. :
John Wiley & Sons,
2011.
|
| 主題: | |
| オンライン･アクセス: | An electronic book accessible through the World Wide Web; click to view |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|
| 要約: | "This book is the first of its kind to collectively address design-based and mechanical micro-manufacturing topics in one place. It focuses on design and materials selection, as well as the manufacturing of micro-products using mechanical-based micro-manufacturing process technologies. After addressing the fundamentals and non-metallic-based micro-manufacturing processes in the semiconductor industry, it goes on to address specific metallic-based micro-manufacturing processes, such as: micro-forming, micro-machining, micro-molding, micro-laser processing, micro-layered manufacturing, micro-joining, micro-assembly and materials handling, and microEDM and ECM. The book provides an in-depth understanding of materials behavior at micro-scales and under different micro-scale processing conditions, while also including a wide variety of emerging micro-scale manufacturing issues and examples"-- "This book is the first of its kind to collectively address design-based and mechanical micro-manufacturing topics in one place. It focuses on design and materials selection, as well as the manufacturing of micro-products using mechanical-based micro-manufacturing process technologies. After addressing the fundamentals and non-metallic-based micro-manufacturing processes in the semiconductor industry, it goes on to address specific metallic-based micro-manufacturing processes, such as: micro-forming, micro-machining, micro-molding, micro-laser processing, micro-layered manufacturing, micro-joining, micro-assembly and materials handling, and microEDM and ECM"-- |
|---|---|
| 物理的記述: | x, 388 p., [4] leaves of color plates : ill. (some col.) |
| 書誌: | Includes bibliographical references and index. |