The future envelope 2 architecture, climate, skin /
I tiakina i:
| Kaituhi rangatōpū: | |
|---|---|
| Ētahi atu kaituhi: | , |
| Hōputu: | Tāhiko īPukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Amsterdam :
IOS Press,
c2009.
|
| Rangatū: | Research in architectural engineering series ;
v. 9. |
| Ngā marau: | |
| Urunga tuihono: | An electronic book accessible through the World Wide Web; click to view |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
| Whakaahutanga tūemi: | Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft. |
|---|---|
| Whakaahuatanga ōkiko: | vii, 142 p. : ill. |
| Rārangi puna kōrero: | Includes bibliographical references. |
| ISSN: | 1873-6033 ; |