Medical device materials III proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA /

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Bibliographic Details
Corporate Authors: Materials & Processes for Medical Devices Conference Boston, Mass., ebrary, Inc
Other Authors: Venugopalan, Ramakrishna, Wu, Ming Hsiung
Format: Electronic Conference Proceeding eBook
Language:English
Published: Materials Park, OH : ASM International, c2006.
Subjects:
Online Access:An electronic book accessible through the World Wide Web; click to view
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111 2 |a Materials & Processes for Medical Devices Conference  |n (3rd :  |d 2005 :  |c Boston, Mass.) 
245 1 0 |a Medical device materials III  |h [electronic resource] :  |b proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA /  |c edited by Ramakrishna Venugopalan, Ming Wu ; sponsored by ASM International. 
260 |a Materials Park, OH :  |b ASM International,  |c c2006. 
300 |a ix, 250 p. :  |b ill. 
500 |a "SAN 204-7586"--T.p. verso. 
504 |a Includes bibliographical references and author index. 
533 |a Electronic reproduction.  |b Palo Alto, Calif. :  |c ebrary,  |d 2009.  |n Available via World Wide Web.  |n Access may be limited to ebrary affiliated libraries. 
650 0 |a Biomedical materials  |v Congresses. 
650 0 |a Biomedical engineering  |v Congresses. 
655 7 |a Electronic books.  |2 local 
700 1 |a Venugopalan, Ramakrishna. 
700 1 |a Wu, Ming Hsiung. 
710 2 |a ebrary, Inc. 
856 4 0 |u http://site.ebrary.com/lib/daystar/Doc?id=10320380  |z An electronic book accessible through the World Wide Web; click to view 
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