Engineering materials for biomedical applications

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Bibliografiske detaljer
Hovedforfatter: Teoh, Swee Hin
Institution som forfatter: ebrary, Inc
Format: Electronisk eBog
Sprog:engelsk
Udgivet: Hackensack, N.J. ; Hong Kong : World Scientific Pub., c2004.
Serier:Biomaterials engineering and processing series ; v. 1.
Fag:
Online adgang:An electronic book accessible through the World Wide Web; click to view
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100 1 |a Teoh, Swee Hin. 
245 1 0 |a Engineering materials for biomedical applications  |h [electronic resource] /  |c Teoh Swee Hin. 
260 |a Hackensack, N.J. ;  |a Hong Kong :  |b World Scientific Pub.,  |c c2004. 
300 |a xvii, 350 p. :  |b ill. (some col.). 
490 1 |a Biomaterials engineering and processing series ;  |v v. 1 
504 |a Includes bibliographical references and index. 
533 |a Electronic reproduction.  |b Palo Alto, Calif. :  |c ebrary,  |d 2009.  |n Available via World Wide Web.  |n Access may be limited to ebrary affiliated libraries. 
650 0 |a Biomedical materials. 
650 0 |a Biomedical engineering. 
655 7 |a Electronic books.  |2 local 
710 2 |a ebrary, Inc. 
830 0 |a Biomaterials engineering and processing series ;  |v v. 1. 
856 4 0 |u http://site.ebrary.com/lib/daystar/Doc?id=10079920  |z An electronic book accessible through the World Wide Web; click to view 
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