Search Results - Liu, Johan

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    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Published 2006
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    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
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  2. 2
    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Published 2006
    Other Authors:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
    Save to List
    Saved in:

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