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Introduction to the explicit finite element method for nonlinear transient dynamics
出版 2012書本目錄: “...Machine generated contents note: PART 1 Fundamentals1 Introduction1.1 Era of Simulation and Computer Aided Engineering1.2 Preliminaries2 Framework of Explicit Finite Element Method for Nonlinear Transient Dynamics2.1 Transient Structural Dynamics2.2 Variational Principles for Transient Dynamics2.3 Finite Element Equations and the Explicit Procedures2.4 Main Features of the Explicit Finite Element Method2.5 Assessment of Explicit Finite Element MethodPART 2 Element Technology3 Four-Node Shell Element (Reissner-Mindlin Plate Theory)3.1 Fundamentals of Plates and Shells3.2 Linear Theory of R-M Plate3.3 Interpolation for Four-Node R-M Plate Element3.4 Reduced Integration and Selective Reduced Integration3.5 Perturbation Hourglass Control - Belytschko-Tsay (B-T) Element3.6 Physical Hourglass Control - Belytschko-Leviathan (B-L) (QPH) Element3.7 Shear Projection Method - Bathe-Dvorkin (B-D) Element3.8 Assessment of Four-Node R-M Plate Element4 Three-Node Shell Element (Reissner-Mindlin Plate Theory)4.1 Fundamentals of a Three-Node C0 Element4.2 Decomposition Method for C0 Triangular Element with One Point Integration4.3 Discrete Kirchhoff Triangular (DKT) Element4.4 Assessment of Three-Node R-M Plate Element5 Eight-Node Solid Element5.1 Trilinear Interpolation for the Eight-Node Hexahedron Element5.2 Locking Issues of the Eight-Node Solid Element5.3 One- Point Reduced Integration and the Perturbed Hourglass Control5.4 Assumed Strain Method and Selective / Reduced Integration5.5 Assumed Deviatoric Strain5.6 An Enhanced Assumed Strain Method5.7 Taylor Expansion of Assumed Strain about the Element Center5.8 Evaluation of Eight-Node Solid Element6 Two-Node Element6.1 Truss and Rod Element6.2 Timoshenko Beam Element6.3 Spring Element6.4 Spot Weld ElementPART 3 Material Models7 Material Model of Plasticity7.1 Fundamentals of Plasticity7.2 Constitutive Equations7.3 Software Implementation7.4 Evaluation of Shell Elements with Plastic Deformation8 Continuum Mechanics Model of Ductile Damage8.1 Concept of Damage Mechanics8.2 Gurson's Model8.3 Chow's Isotropic Model of Continuum Damage Mechanics8.4 Chow's Anisotropic Model of Continuum Damage Mechanics9 Models of Nonlinear Materials9.1 Vicoelasticity9.2 Polymer and Engineering Plastics9.3 Rubber9.4 Foam9.5 Honeycomb9.6 Laminated GlazingPART 4 Contact and Constraint Conditions10 Three-Dimensional Surface Contact10.1 Examples of Contact Problems10.2 Description of Contact Conditions10.3 Variational Principle for the Dynamic Contact Problem10.4 Penalty Method and the Regularization of Variational Inequality11 Numerical Procedures for Three-Dimensional Surface Contact11.1 A Contact Algorithm with Slave Node Searching Master Segment11.2 A Contact Algorithm with Master Segment Searching Slave Node11.3 Method of Contact Territory and Defense Node11.4 Pin- Ball Contact Algorithm11.5 Edge (Line Segment) Contact11.6 Evaluation of Contact Algorithm with Penalty Method12 Kinematic Constraint Conditions12.1 Rigid Wall12.2 Rigid Body12.3 Explicit Finite Element Procedure with Constraint Conditions12.4 Application Examples with Constraint Conditions....”
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AIChE equipment testing procedure. a guide to performance evaluation /
出版 2014書本目錄: “...Machine generated contents note: 100.0 PURPOSE & SCOPE 1 101.0 Purpose 1 102.0 Scope 1 200.0 DEFINITION AND DESCRIPTION OF TERMS 2 201.0 Flow Quantities 2 202.0 Key Components 3 203.0 Mass Transfer Efficiency 4 203.1 Theoretical Trays or Plates or Stages 4 203.2 Overall Column Efficiency 4 203.3 Apparent Murphree Tray Efficiency 4 203.4 Ideal Murphree Tray Efficiency 4 203.5 Murphree Point Efficiency 4 203.6 HETP 4 203.7 HTU 4 203.8 NTU 4 204.0 Operating Lines 5 205.0 Pinch 5 206.0 Maximum Throughput 5 206.1 Maximum Hydraulic Throughput 5 206.2 Maximum Operational Capacity 5 206.3 Maximum Efficient Capacity 5 207.0 Minimum Operating Rate 5 208.0 Operating Section 5 209.0 Hardware 6 209.1 Components of a Trayed Column 6 209.2 Components of a Packed Column 7 300.0 TEST PLANNING 9 301.0 Preliminary Preparation 9 301.1 Safety 10 301.2 Environmental Considerations 10 301.3 Test Objectives 10 301.4 Organizational Resources 10 301.5 Schedule 10 301.6 Review of Historic Operating Data 10 302.0 Column Control and Instrumentation 11 303.0 Peripheral Equipment 11 304.0 Pre-test Calculations 11 304.1 Process Simulation 11 304.2 Dry Run 11 305.0 Types of Tests 12 305.1 Performance Tests 12 305.2 Acceptance Tests 12 306.0 Specific Areas of Interest 12 306.1 Packing Efficiencies 12 306.2 Tray Efficiencies 12 306.3 Overall Column Efficiency 13 306.4 Capacity Limitations 13 307.0 Energy Consumption 14 308.0 Pressure Drop Restrictions 15 309.0 Data Collection Requirements 15 309.1 Process Operating Data 15 309.2 Gamma Scan Data 15 310.0 Conditions of External Streams 18 310.1 Overall and Component Material Balances 18 310.2 Overall Enthalpy Balances 18 311.0 Internal Temperatures 18 311.1 Heat Balances 18 311.2 Internal Profiles 18 312.0 Internal Samples 20 312.1 Internal Samples for Efficiency Checks 20 312.2 Internal Samples for Overall Performance 20 313.0 Pressure Profiles 20 314.0 Data Requirements-Physical Properties 20 314.1 Test Mixtures 20 314.2 Essential Data 21 315.0 Auxiliary Data 21 316.0 Test Procedure Documentation 21 400.0 METHODS OF MEASUREMENT AND SAMPLING 22 401.0 System Controls and Operating Stability 22 402.0 Measurement of Temperatures 22 402.1 Accuracy 22 402.2 Errors 22 403.0 Measurement of Flow Rates 24 403.1 Orifice Meters 24 403.2 Rotameters 25 403.3 Vortex Flow Meters 25 403.4 Coriolis Flow Meters 25 403.5 Magnetic Flow Meters 25 403.6 Pitot Tube (or Annubar) 25 403.7 Direct Volume or Weight Measurement 26 404.0 Measurement of Column Pressure Drop 26 404.1 Instrument 26 404.2 Pressure Taps 26 404.3 Seal Pots 33 404.4 Leakage Check 33 404.5 Accuracy 33 405.0 Sampling Procedure 34 405.1 General 34 405.2 Selection of Sampling Points 34 405.3 Sample Connections 35 405.4 Containers 35 405.5 Sampling of High Boiling Materials 36 405.6 Sampling of Intermediate Boiling Materials 37 405.7 Sampling of Materials Having Boiling Points Below -50°F (-46°C) 40 405.8 Leakage Check 41 405.9 Labeling and Handling the Samples 41 500.0 TEST PROCEDURE 43 501.0 Preliminary 43 502.0 Test Procedure for Maximum Hydraulic Throughput 43 502.1 Flood Symptoms 44 502.2 Performing Capacity Tests 45 502.3 Optional Test Technique - Gamma Scanning 48 503.0 Considerations Affecting Efficiency Test Procedure 48 503.1 Rigorous Versus Shortcut Efficiency Tests 48 503.2 Strategy of Efficiency Testing 49 503.3 Early Preparation for Efficiency Tests 50 503.4 Last-minute Preparations for Efficiency Tests 53 503.5 Establishment of Steady State Conditions 55 503.6 The Test Day 56 503.7 Concluding Test 56 600.0 COMPUTATION OF RESULTS 601.0 Verification of Test Data and Simulation Models 58 602.0 Material Balance 59 602.1 End Effects 59 603.0 Enthalpy Balance 59 603.1 Overall Balance 59 603.2 Internal Flow Rates 60 604.0 Hydraulic Performance 60 604.1 Trayed Column 60 604.2 Packed Column 61 605.0 Efficiency Performance 61 605.1 Trayed Column 62 605.2 Packed Column 69 700.0 INTERPRETATION OF RESULTS 76 701.0 Sources of Experimental Error 76 701.1 Material and Enthalpy Balances 77 702.0 Effects of Experimental Error 78 703.0 Design versus Performance 78 703.1 Mechanical/Tower Equipment 78 703.2 Process Conditions 78 704.0 Hydraulic Performance 79 704.1 Mechanical/Tower Equipment 79 704.2 Tray 79 704.3 Packing 80 704.4 Process Conditions 80 705.0 Mass Transfer Performance 81 705.1 Mechanical/Tower Equipment 81 705.2 Tray 81 705.3 Packing 82 705.4 Maldistribution 82 705.5 Process 84 706.0 Test Troubleshooting 85 706.1 Analysis Procedure 85 706.2 Sampling 85 706.3 Equilibrium Data 85 706.4 Temperature Measurements 85 706.5 Heat and Material Balances 86 706.6 Fluctuation of Process Conditions 86 706.7 Pressure Drop Measurements 86 706.8 Incorrect Prediction of Pressure Drop 86 706.9 Errors in Assumptions in Modeling Mass Transfer 86 706.10 Multicomponent Systems Deviate from Binary Data 87 706.11 High Purity Separation 87 706.12 Test and Design Conditions 87 800.0 APPENDIX 88 801.0 Notation 88 801.1 Greek Symbols 90 802.0 Sample Calculations 90 802.1 General Analysis of Test Data 90 802.2 Packed Column 91 802.3 Trayed Column 107 803.0 References 126....”
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Guide to state-of-the-art electron devices
出版 2013書本目錄: “...Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index....”
An electronic book accessible through the World Wide Web; click to view
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