Search Results - "simulation"

Fundamentals of materials for energy and environmental sustainability

Table of Contents: “…Toward stronger, smarter, and more secure electric power grids: advances and challenges in distributed sensing, modeling, simulation, and control; 43. Consequences of high penetration renewables; 44. …”
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Solid-state NMR basic principles & practice / by Apperley, David C.

Table of Contents: “…Introduction to solid-state NMR simulation -- D.1 Specifying the spin system -- D.2 Specifying the powder sampling -- D.3 Specifying the pulse sequence -- D.4 Efficiency of calculation -- Index.…”
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Micro- and nano-structured interpenetrating polymer networks : from design to applications /

Table of Contents: “…Theoretical Simulations 14.2.1 Quantum Mechanics 14.2.2 Classical Mechanics 14.3. …”
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Micro- and nano-structured interpenetrating polymer networks : from design to applications /

Table of Contents: “…Theoretical Simulations 14.2.1 Quantum Mechanics 14.2.2 Classical Mechanics 14.3. …”
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Introduction to the explicit finite element method for nonlinear transient dynamics by Wu, Shen R., 1945-

Table of Contents: “…Machine generated contents note: PART 1 Fundamentals1 Introduction1.1 Era of Simulation and Computer Aided Engineering1.2 Preliminaries2 Framework of Explicit Finite Element Method for Nonlinear Transient Dynamics2.1 Transient Structural Dynamics2.2 Variational Principles for Transient Dynamics2.3 Finite Element Equations and the Explicit Procedures2.4 Main Features of the Explicit Finite Element Method2.5 Assessment of Explicit Finite Element MethodPART 2 Element Technology3 Four-Node Shell Element (Reissner-Mindlin Plate Theory)3.1 Fundamentals of Plates and Shells3.2 Linear Theory of R-M Plate3.3 Interpolation for Four-Node R-M Plate Element3.4 Reduced Integration and Selective Reduced Integration3.5 Perturbation Hourglass Control - Belytschko-Tsay (B-T) Element3.6 Physical Hourglass Control - Belytschko-Leviathan (B-L) (QPH) Element3.7 Shear Projection Method - Bathe-Dvorkin (B-D) Element3.8 Assessment of Four-Node R-M Plate Element4 Three-Node Shell Element (Reissner-Mindlin Plate Theory)4.1 Fundamentals of a Three-Node C0 Element4.2 Decomposition Method for C0 Triangular Element with One Point Integration4.3 Discrete Kirchhoff Triangular (DKT) Element4.4 Assessment of Three-Node R-M Plate Element5 Eight-Node Solid Element5.1 Trilinear Interpolation for the Eight-Node Hexahedron Element5.2 Locking Issues of the Eight-Node Solid Element5.3 One- Point Reduced Integration and the Perturbed Hourglass Control5.4 Assumed Strain Method and Selective / Reduced Integration5.5 Assumed Deviatoric Strain5.6 An Enhanced Assumed Strain Method5.7 Taylor Expansion of Assumed Strain about the Element Center5.8 Evaluation of Eight-Node Solid Element6 Two-Node Element6.1 Truss and Rod Element6.2 Timoshenko Beam Element6.3 Spring Element6.4 Spot Weld ElementPART 3 Material Models7 Material Model of Plasticity7.1 Fundamentals of Plasticity7.2 Constitutive Equations7.3 Software Implementation7.4 Evaluation of Shell Elements with Plastic Deformation8 Continuum Mechanics Model of Ductile Damage8.1 Concept of Damage Mechanics8.2 Gurson's Model8.3 Chow's Isotropic Model of Continuum Damage Mechanics8.4 Chow's Anisotropic Model of Continuum Damage Mechanics9 Models of Nonlinear Materials9.1 Vicoelasticity9.2 Polymer and Engineering Plastics9.3 Rubber9.4 Foam9.5 Honeycomb9.6 Laminated GlazingPART 4 Contact and Constraint Conditions10 Three-Dimensional Surface Contact10.1 Examples of Contact Problems10.2 Description of Contact Conditions10.3 Variational Principle for the Dynamic Contact Problem10.4 Penalty Method and the Regularization of Variational Inequality11 Numerical Procedures for Three-Dimensional Surface Contact11.1 A Contact Algorithm with Slave Node Searching Master Segment11.2 A Contact Algorithm with Master Segment Searching Slave Node11.3 Method of Contact Territory and Defense Node11.4 Pin- Ball Contact Algorithm11.5 Edge (Line Segment) Contact11.6 Evaluation of Contact Algorithm with Penalty Method12 Kinematic Constraint Conditions12.1 Rigid Wall12.2 Rigid Body12.3 Explicit Finite Element Procedure with Constraint Conditions12.4 Application Examples with Constraint Conditions.…”
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Introduction to the explicit finite element method for nonlinear transient dynamics by Wu, Shen R., 1945-

Table of Contents: “…Machine generated contents note: PART 1 Fundamentals1 Introduction1.1 Era of Simulation and Computer Aided Engineering1.2 Preliminaries2 Framework of Explicit Finite Element Method for Nonlinear Transient Dynamics2.1 Transient Structural Dynamics2.2 Variational Principles for Transient Dynamics2.3 Finite Element Equations and the Explicit Procedures2.4 Main Features of the Explicit Finite Element Method2.5 Assessment of Explicit Finite Element MethodPART 2 Element Technology3 Four-Node Shell Element (Reissner-Mindlin Plate Theory)3.1 Fundamentals of Plates and Shells3.2 Linear Theory of R-M Plate3.3 Interpolation for Four-Node R-M Plate Element3.4 Reduced Integration and Selective Reduced Integration3.5 Perturbation Hourglass Control - Belytschko-Tsay (B-T) Element3.6 Physical Hourglass Control - Belytschko-Leviathan (B-L) (QPH) Element3.7 Shear Projection Method - Bathe-Dvorkin (B-D) Element3.8 Assessment of Four-Node R-M Plate Element4 Three-Node Shell Element (Reissner-Mindlin Plate Theory)4.1 Fundamentals of a Three-Node C0 Element4.2 Decomposition Method for C0 Triangular Element with One Point Integration4.3 Discrete Kirchhoff Triangular (DKT) Element4.4 Assessment of Three-Node R-M Plate Element5 Eight-Node Solid Element5.1 Trilinear Interpolation for the Eight-Node Hexahedron Element5.2 Locking Issues of the Eight-Node Solid Element5.3 One- Point Reduced Integration and the Perturbed Hourglass Control5.4 Assumed Strain Method and Selective / Reduced Integration5.5 Assumed Deviatoric Strain5.6 An Enhanced Assumed Strain Method5.7 Taylor Expansion of Assumed Strain about the Element Center5.8 Evaluation of Eight-Node Solid Element6 Two-Node Element6.1 Truss and Rod Element6.2 Timoshenko Beam Element6.3 Spring Element6.4 Spot Weld ElementPART 3 Material Models7 Material Model of Plasticity7.1 Fundamentals of Plasticity7.2 Constitutive Equations7.3 Software Implementation7.4 Evaluation of Shell Elements with Plastic Deformation8 Continuum Mechanics Model of Ductile Damage8.1 Concept of Damage Mechanics8.2 Gurson's Model8.3 Chow's Isotropic Model of Continuum Damage Mechanics8.4 Chow's Anisotropic Model of Continuum Damage Mechanics9 Models of Nonlinear Materials9.1 Vicoelasticity9.2 Polymer and Engineering Plastics9.3 Rubber9.4 Foam9.5 Honeycomb9.6 Laminated GlazingPART 4 Contact and Constraint Conditions10 Three-Dimensional Surface Contact10.1 Examples of Contact Problems10.2 Description of Contact Conditions10.3 Variational Principle for the Dynamic Contact Problem10.4 Penalty Method and the Regularization of Variational Inequality11 Numerical Procedures for Three-Dimensional Surface Contact11.1 A Contact Algorithm with Slave Node Searching Master Segment11.2 A Contact Algorithm with Master Segment Searching Slave Node11.3 Method of Contact Territory and Defense Node11.4 Pin- Ball Contact Algorithm11.5 Edge (Line Segment) Contact11.6 Evaluation of Contact Algorithm with Penalty Method12 Kinematic Constraint Conditions12.1 Rigid Wall12.2 Rigid Body12.3 Explicit Finite Element Procedure with Constraint Conditions12.4 Application Examples with Constraint Conditions.…”
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Designs and prototypes of mobile robots /

Table of Contents: “…Networked control for mobile robots / Xilung Ding -- 4.1 Introduction -- 4.2 Applications of networked control mobile robots -- 4.3 Introduction of NOROs robots -- 4.4 Advantages and challenges -- 4.5 Control challenges and achievements -- 4.5.1 Overview of NCS -- 4.5.2 Major accomplishments -- 4.6 Communication challenges and achievements -- 4.6.1 Key problems -- 4.6.2 Major accomplishments -- 4.6.3 Dynamic lunar exploration robots routing protocol -- 4.6.4 Dynamic lunar exploration robots routing protocol -- 4.6.5 The optimal ad hoc routing protocols design for multi moon exploration robots system -- 4.6.6 Simulation and results -- 4.7 Perception challenges and achievements -- 4.7.1 Key problems -- 4.7.2 Major accomplishments -- 4.7.3 Dynamic CSS localization system for NOROS robots -- 4.8 Conclusions and future works -- 4.9 References --…”
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Designs and prototypes of mobile robots /

Table of Contents: “…Networked control for mobile robots / Xilung Ding -- 4.1 Introduction -- 4.2 Applications of networked control mobile robots -- 4.3 Introduction of NOROs robots -- 4.4 Advantages and challenges -- 4.5 Control challenges and achievements -- 4.5.1 Overview of NCS -- 4.5.2 Major accomplishments -- 4.6 Communication challenges and achievements -- 4.6.1 Key problems -- 4.6.2 Major accomplishments -- 4.6.3 Dynamic lunar exploration robots routing protocol -- 4.6.4 Dynamic lunar exploration robots routing protocol -- 4.6.5 The optimal ad hoc routing protocols design for multi moon exploration robots system -- 4.6.6 Simulation and results -- 4.7 Perception challenges and achievements -- 4.7.1 Key problems -- 4.7.2 Major accomplishments -- 4.7.3 Dynamic CSS localization system for NOROS robots -- 4.8 Conclusions and future works -- 4.9 References --…”
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Hostile intent and counter-terrorism : human factors theory and application /

Table of Contents: “…Merging crime control and counter-terrorism in the UK / Pete Fussey -- Analysing the terrorist brain: neurobiological advances, ethical concerns and social implications / Valentina Bartolucci -- Ethical issues in surveillance and privacy / Ron Iphofen -- Deception and decision-making -- Non-verbal cues to deception and their relationship to terrorism / Dawn L Eubanks, Ke Zhang and Lara Frumkin -- Deception detection in counter-terrorism / Aldert Vrij, Sharon Leal and Samantha Mann -- A field trial to investigate human pheromones associated with hostile intent / Peter Eachus, Alex Stedmon and Les Baillie -- On the trail of the terrorist: a research environment to simulate criminal investigations / Alexandra L Sandham, Thomas C Ormerod, Coral J Dando and Tarek Menacere -- Modeling hostile intent -- Safety and security in rail systems: drawing knowledge from the prevention of railway suicide and trespass to inform security interventions / Brendan Ryan -- Tackling financial and economic crime through strategic intelligence management / Simon Andrews, Simon Polovina, Babak Akhgar, Alex Stedmon, Andrew Staniforth and Dave Fortune -- Competitive adaptation in militant networks: preliminary findings from an Islamist case study / Michael Kenney, John Horgan, Cale Horne, Peter Vining, Kathleen M. …”
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Hostile intent and counter-terrorism : human factors theory and application /

Table of Contents: “…Merging crime control and counter-terrorism in the UK / Pete Fussey -- Analysing the terrorist brain: neurobiological advances, ethical concerns and social implications / Valentina Bartolucci -- Ethical issues in surveillance and privacy / Ron Iphofen -- Deception and decision-making -- Non-verbal cues to deception and their relationship to terrorism / Dawn L Eubanks, Ke Zhang and Lara Frumkin -- Deception detection in counter-terrorism / Aldert Vrij, Sharon Leal and Samantha Mann -- A field trial to investigate human pheromones associated with hostile intent / Peter Eachus, Alex Stedmon and Les Baillie -- On the trail of the terrorist: a research environment to simulate criminal investigations / Alexandra L Sandham, Thomas C Ormerod, Coral J Dando and Tarek Menacere -- Modeling hostile intent -- Safety and security in rail systems: drawing knowledge from the prevention of railway suicide and trespass to inform security interventions / Brendan Ryan -- Tackling financial and economic crime through strategic intelligence management / Simon Andrews, Simon Polovina, Babak Akhgar, Alex Stedmon, Andrew Staniforth and Dave Fortune -- Competitive adaptation in militant networks: preliminary findings from an Islamist case study / Michael Kenney, John Horgan, Cale Horne, Peter Vining, Kathleen M. …”
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Engineering decision making and risk management / by Herrmann, Jeffrey W.

Table of Contents: “…Decision Making Under Uncertainty 5.1 Types of Uncertainties 5.2 Assessing a Subjective Probability 5.3 Imprecise Probabilities 5.4 Cumulative Risk Profile and Dominance 5.5 Decision Trees: Modeling 5.6 Decision Trees: Determining Expected Values 5.7 Sequential Decision Making 5.8 Modeling Risk Aversion 5.9 Robustness 5.10 Uncertainty Propagation: Sensitivity Analysis 5.11 Uncertainty Propagation: Method of Moments 5.12 Uncertainty Propagation: Monte Carlo Simulation Exercises References 6. Game Theory 6.1 Game Theory Basics 6.2 Zero-sum Games 6.3 Optimal Mixed Strategies for Zero-sum Games 6.4 The Minimax Theorem 6.5 Resource Allocation Games 6.6 Mixed Motive Games 6.7 Bidding 6.8 Stackelberg Games Exercises References 7. …”
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Engineering decision making and risk management / by Herrmann, Jeffrey W.

Table of Contents: “…Decision Making Under Uncertainty 5.1 Types of Uncertainties 5.2 Assessing a Subjective Probability 5.3 Imprecise Probabilities 5.4 Cumulative Risk Profile and Dominance 5.5 Decision Trees: Modeling 5.6 Decision Trees: Determining Expected Values 5.7 Sequential Decision Making 5.8 Modeling Risk Aversion 5.9 Robustness 5.10 Uncertainty Propagation: Sensitivity Analysis 5.11 Uncertainty Propagation: Method of Moments 5.12 Uncertainty Propagation: Monte Carlo Simulation Exercises References 6. Game Theory 6.1 Game Theory Basics 6.2 Zero-sum Games 6.3 Optimal Mixed Strategies for Zero-sum Games 6.4 The Minimax Theorem 6.5 Resource Allocation Games 6.6 Mixed Motive Games 6.7 Bidding 6.8 Stackelberg Games Exercises References 7. …”
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Balanced Urban Development: Options and Strategies for Liveable Cities

Table of Contents: “…Planning Development to Reduce Mosquito Hazard in Coastal Peri-Urban Areas: Case Studies in NSW, Australia -- 34. An Integrated Simulation and Visualisation Platform for the Design of Sustainable Urban Developments in a Peri-Urban Context -- 35. …”
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Balanced Urban Development: Options and Strategies for Liveable Cities

Table of Contents: “…Planning Development to Reduce Mosquito Hazard in Coastal Peri-Urban Areas: Case Studies in NSW, Australia -- 34. An Integrated Simulation and Visualisation Platform for the Design of Sustainable Urban Developments in a Peri-Urban Context -- 35. …”
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The Interconnected Arctic — UArctic Congress 2016

Table of Contents: “….- Chapter 8 Hydrological probabilistic model MARCS and its application to simulate the probability density functions of multi-year maximal runoff: the Russian Arctic as a case of study -- Chapter 9 Student contribution: Assessment of Atmospheric Circulation in the Atlantic-Eurasian Region and Arctic Using Climate Indices. …”
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Advancing Culture of Living with Landslides Volume 1 ISDR-ICL Sendai Partnerships 2015-2025 /

Table of Contents: “…ISDR-ICL Sendai Partnerships 2015-2025 -- The ISDR-ICL Sendai Partnerships 2015-2025: Background and Content -- Forum lectures -- Rupestrian world heritage sites: Instability investigation and sustainable mitigation -- Subaerial landslide-generated waves: Numerical and laboratory simulations -- Rockfall occurrence and fragmentation -- Contribution from signatory organizations of the Sendai Partnerships -- International Consortium on Landslides (ICL) -- International Consortium on Landslides (ICL) - The proposing organization of the ISDR-ICL Sendai partnerships 2015-2025 -- United Nations Office for Disaster Risk Reduction (UNISDR) -- UNISDR‘s Contribution to Science and Technology for Disaster Risk Reduction and the Role of the International Consortium on Landslides (ICL) -- United Nations Educational, Scientific and Cultural Organization (UNESCO) -- UNESCO’s Contribution to the Implementation of UNISDR’s Global Initiative and ICL -- United Nations University (UNU) -- The United Nations University: Research and Policy Support for Environmental Risk Reduction -- World Meteorological Organization (WMO) -- Concerted International Efforts for Advancing Multi-Hazard Early Warning Systems -- International Council for Science (ICSU) -- On Future Challenges for the Integration of Science into International Policy Development for Landslide Disaster Risk Reduction -- World Federation of Engineering Organizations (WFEO) -- World Federation of Engineering Organizations Activities in Disaster Risk Reduction -- Disaster Prevention Research Institute (DPRI), Kyoto University -- National Civil Protection Department, Italian Presidency of the Council of Ministers, Government of Italy -- Understanding and Reducing Landslide Disaster Risk: Challenges and Opportunities for Italian Civil Protection -- Landslide Dynamics: ISDR-ICL Landslide Interactive Teaching Tools (LITT) -- Progress of the World Report on Landslides -- International Programme on Landslides (IPL): Objectives, History and List of World Centres of Excellence and IPL Projects -- UNESCO-KU-ICL UNITWIN Cooperation Programme for Landslides and Water-Related Disaster Risk Management. …”
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The Interconnected Arctic — UArctic Congress 2016

Table of Contents: “….- Chapter 8 Hydrological probabilistic model MARCS and its application to simulate the probability density functions of multi-year maximal runoff: the Russian Arctic as a case of study -- Chapter 9 Student contribution: Assessment of Atmospheric Circulation in the Atlantic-Eurasian Region and Arctic Using Climate Indices. …”
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Advancing Culture of Living with Landslides Volume 1 ISDR-ICL Sendai Partnerships 2015-2025 /

Table of Contents: “…ISDR-ICL Sendai Partnerships 2015-2025 -- The ISDR-ICL Sendai Partnerships 2015-2025: Background and Content -- Forum lectures -- Rupestrian world heritage sites: Instability investigation and sustainable mitigation -- Subaerial landslide-generated waves: Numerical and laboratory simulations -- Rockfall occurrence and fragmentation -- Contribution from signatory organizations of the Sendai Partnerships -- International Consortium on Landslides (ICL) -- International Consortium on Landslides (ICL) - The proposing organization of the ISDR-ICL Sendai partnerships 2015-2025 -- United Nations Office for Disaster Risk Reduction (UNISDR) -- UNISDR‘s Contribution to Science and Technology for Disaster Risk Reduction and the Role of the International Consortium on Landslides (ICL) -- United Nations Educational, Scientific and Cultural Organization (UNESCO) -- UNESCO’s Contribution to the Implementation of UNISDR’s Global Initiative and ICL -- United Nations University (UNU) -- The United Nations University: Research and Policy Support for Environmental Risk Reduction -- World Meteorological Organization (WMO) -- Concerted International Efforts for Advancing Multi-Hazard Early Warning Systems -- International Council for Science (ICSU) -- On Future Challenges for the Integration of Science into International Policy Development for Landslide Disaster Risk Reduction -- World Federation of Engineering Organizations (WFEO) -- World Federation of Engineering Organizations Activities in Disaster Risk Reduction -- Disaster Prevention Research Institute (DPRI), Kyoto University -- National Civil Protection Department, Italian Presidency of the Council of Ministers, Government of Italy -- Understanding and Reducing Landslide Disaster Risk: Challenges and Opportunities for Italian Civil Protection -- Landslide Dynamics: ISDR-ICL Landslide Interactive Teaching Tools (LITT) -- Progress of the World Report on Landslides -- International Programme on Landslides (IPL): Objectives, History and List of World Centres of Excellence and IPL Projects -- UNESCO-KU-ICL UNITWIN Cooperation Programme for Landslides and Water-Related Disaster Risk Management. …”
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Guide to state-of-the-art electron devices

Table of Contents: “…Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index.…”
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Guide to state-of-the-art electron devices

Table of Contents: “…Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index.…”
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