Search Results - "semiconductor"

  1. 341

    Patents in the knowledge-based economy

    Published 2003
    Subjects:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  2. 342

    Patents in the knowledge-based economy

    Published 2003
    Subjects:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  3. 343
  4. 344

    Microelectronic failure analysis desk reference.

    Published 2002
    Subjects:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  5. 345

    Microelectronics failure analysis desk reference /

    Published 2011
    Subjects:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  6. 346
  7. 347

    Microelectronic failure analysis desk reference.

    Published 2002
    Subjects:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  8. 348

    Microelectronics failure analysis desk reference /

    Published 2011
    Subjects:
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  9. 349

    A one-semester course in modeling of VLSI interconnections / by Goel, Ashok K., 1953-

    Published 2015
    Table of Contents: “…Modeling of interconnection delays -- 3.1 Metal-insulator-semiconductor microstrip line model of an interconnection -- 3.2 Transmission line analysis of single-level interconnections -- 3.3 Transmission line model for multilevel interconnections -- 3.4 Modeling of parallel and crossing interconnections -- 3.5 Modeling of very-high-frequency losses in interconnections -- 3.6 Compact modeling of interconnection delays -- 3.7 Modeling of active interconnections --…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  10. 350

    A one-semester course in modeling of VLSI interconnections / by Goel, Ashok K., 1953-

    Published 2015
    Table of Contents: “…Modeling of interconnection delays -- 3.1 Metal-insulator-semiconductor microstrip line model of an interconnection -- 3.2 Transmission line analysis of single-level interconnections -- 3.3 Transmission line model for multilevel interconnections -- 3.4 Modeling of parallel and crossing interconnections -- 3.5 Modeling of very-high-frequency losses in interconnections -- 3.6 Compact modeling of interconnection delays -- 3.7 Modeling of active interconnections --…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  11. 351

    High-power and femtosecond lasers properties, materials and applications /

    Published 2009
    Table of Contents: “…Dynamics of excitons confined in semiconductor thin films /…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  12. 352

    High-power and femtosecond lasers properties, materials and applications /

    Published 2009
    Table of Contents: “…Dynamics of excitons confined in semiconductor thin films /…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  13. 353

    US-China trade disputes rising tide, rising stakes / by Hufbauer, Gary Clyde

    Published 2006
    Table of Contents: “…The revaluation debate -- Textiles and clothing -- Intellectual property rights -- The CNOOC case -- Semiconductor chips and automobile parts -- Antidumping disputes.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  14. 354

    US-China trade disputes rising tide, rising stakes / by Hufbauer, Gary Clyde

    Published 2006
    Table of Contents: “…The revaluation debate -- Textiles and clothing -- Intellectual property rights -- The CNOOC case -- Semiconductor chips and automobile parts -- Antidumping disputes.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  15. 355

    Reprogramming Japan : the high tech crisis under communitarian capitalism / by Anchordoguy, Marie

    Published 2005
    Table of Contents: “…-- Software : programmed for failure -- Semiconductors : from boom to bust -- Crisis in communitarian capitalism.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  16. 356

    Reprogramming Japan : the high tech crisis under communitarian capitalism / by Anchordoguy, Marie

    Published 2005
    Table of Contents: “…-- Software : programmed for failure -- Semiconductors : from boom to bust -- Crisis in communitarian capitalism.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  17. 357

    Guide to state-of-the-art electron devices

    Published 2013
    Table of Contents: “…Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  18. 358

    Guide to state-of-the-art electron devices

    Published 2013
    Table of Contents: “…Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  19. 359

    Innovation, product development and commercialization case studies and key practices for market leadership / by Rafinejad, Dariush, 1943-

    Published 2007
    Table of Contents: “…High technology--strategic context -- Product development strategies -- Marketing management -- Product platform and knowledge integration -- The product development process -- Excellence in design and product reliability -- Flawless execution and global resources management -- Project management in product development -- Best practices for product development managers -- Managing product and technology portfolios for shareholder value -- Appendix : semiconductor manufacturing process equipment -- Index.…”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
  20. 360

    Technology change and the rise of new industries by Funk, Jeffrey L.

    Published 2013
    Table of Contents: “…Computers -- Magnetic recording and playback equipment -- Semiconductors -- part III. Opportunities and challenges for firms and governments. …”
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook