Search Results - "optics"
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781
Crystals and crystallinity in polymers : diffraction analysis of ordered and disordered crystals /
Published 2014Table of Contents: “…Machine generated contents note: Chapter 1 Configuration and Conformation of Macromolecules in Polymer Crystals 1.1 Crystals of polymers 1.2 Constitution and configuration of crystalline polymers 1.3 Conformation 1.4 Relationships among internal parameters of macromolecules 1.5 Conformation of polymer chains in the crystalline state 1.6 Helical conformations in isotactic and syndiotactic polymers 1.7 Conformational energy calculations 1.8 Helical conformation and optical activity 1.9 Alternating copolymers 1.10 Polydienes 1.11 Non helical chain conformations of isotactic polymers References Chapter 1 Chapter 2 Packing of macromolecules in polymer crystals 2.1 General principles 2.2 The principle of density (entropy)-driven phase formation in polymers 2.3 Symmetry breaking 2.4 Impact of chain folding on crystal structure symmetry 2.5 Frustrated Polymer Crystal Structures 2.6 Chiral crystallization of polymers with helical chain conformations 2.7 Packing effects on the conformation of polymer chains in the crystals: the case of aliphatic polyamides References Chapter 2 Chapter 3 3.1 X-ray diffraction of semicrystalline polymers 3.2 Fourier synthesis and the phase problem in crystallography 3.3 X-ray fiber diffraction analysis 3.4 Determination of parameters of the unit cell and indexing of the diffraction pattern 3.5 Measure of the integrated intensities of the reflections and corrections for geometrical (Lorentz), polarization and absorption factors 3.6 Calculation of Structure Factors 3.7 Structural refinement 3.8 Form of diffraction pattern and broadening due to the Laue function References Chapter 3 Chapter 4 Defects and Disorder in Polymer Crystals 4.1 Classification of different types of structural disorder 4.2 Crystals with partial three-dimensional order (Class A)Disorder with three-dimensional periodicity maintained only for some characterizing points of the structure 4.3 Solid mesophases References Chapter 4 Chapter 5 Methods of Analysis of Diffuse Scattering from Disordered Structures of Polymers 5.1 Structural disorder and diffuse scattering 5.2 Methods of diffraction analysis from disordered crystals 5.3 Long Range Order in Disordered Lattices of Class A 5.4 Short Range Order in Disordered Crystals of Class A 5.5 Short Range Order in Disordered Crystals with Substitution type Disorder 5.6 Short Range vs Long Range Order in Disordered Crystals of Class B and C (Solid Mesophases) 5.7 Disordered Models with Perturbations Occurring over Continuous Ranges 5.8 Basic formulas for the calculation of X-ray Diffraction Intensity from Disordered Model Structures of Polymers 5.9 Examples of calculation of average diffracted intensity of structures disordered in one dimension 5.10 Integration method of diffraction intensity for cylindrically and spherical surfaces in the reciprocal space References Chapter 5 Chapter 6 Crystal habit 6.1 Basic remark 6.2 Rounded lateral habits 6.3 Chain folding, molecular orientation and sectorization 6.4 Twinning and secondary nucleation theory 6.5 Homoepitaxy, morphology, stem orientation and polymorphism References Chapter 6 Chapter 7 Influence of Crystal Defects and Structural Disorder on the Physical and Mechanical Properties of Polymeric Materials 7.1 Introduction 7.2 Stress induced phase transformations during deformation 7.3 Isotactic polypropylene 7.4 Syndiotactic Polypropylene References Chapter 7.…”
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782
Gravitational lensing and microlensing
Published 2002Table of Contents: “…Machine generated contents note: Preface vii -- Chapter 1 Historical introduction 1 -- Chapter 2 The deflection of light 7 -- 2.1 Basics of General Relativity7 -- 2.1.1 Introduction7 -- 2.1.2 Tensors in curved spacetimes 9 -- 2.1.3 Motion of particles 13 -- 2.1.4 The spacetime curvature15 -- 2.1.5 The Einstein equation17 -- 2.1.6 The Schwarzschild metric 18 -- 2.2 The bending of light21 -- 2.2.1 Point-like deflector21 -- 2.2.2 Time delay24 -- 2.2.3 Extended mass distribution25 -- Chapter 3 Gravitational lensing theory 29 -- 3.1 The lens equation29 -- 3.1.1 Point-like lenses 29 -- 3.1.2 Extended lenses33 -- 3.2 The surface brightness conservation 34 -- 3.3 Amplification35 -- 3.4 Caustics and critical lines41 -- 3.5 Fermat's principle42 -- 3.6 Galaxy lens models45 -- 3.6.1 Circularly symmetric lenses45 -- 3.6.2 Non-circularly symmetric lenses50 -- 3.7 The folded sky51 -- 3.8 Folds and cusps58 -- 3.8.1 Magnification near a fold60 -- 3.8.2 Magnification near a cusp62 -- 3.8.3 The binary lens65 -- Chapter 4 Macrolensing results 69 -- 4.1 Lensing of quasars70 -- 4.2 Time delays and Ho74 -- 4.3 Statistical lensing and cosmological parameters78 -- 4.4 Strong lensing by clusters81 -- 4.5 Weak lensing in clusters84 -- 4.6 Cosmic shear87 -- 4.7 Quasar-galaxy correlations94 -- 4.8 Lensing of the Cosmic Microwave Background94 -- Chapter 5 Microlensing I: Basics 99 -- 5.1 The Galaxy in brief100 -- 5.1.1 The thin and thick disks100 -- 5.1.2 Galactic spheroid and bulge101 -- 5.1.3 The dark halo103 -- 5.2 Basic microlensing theoretical tools105 -- 5.2.1 The light curve105 -- 5.2.2 Optical depth107 -- 5.2.3 Event duration distribution108 -- 5.3 Microlensing of unresolved sources114 -- 5.4 Observational searches of microlensing117 -- 5.4.1 Searches towards the Magellanic Clouds118 -- 5.4.2 Searches towards the bulge122 -- Chapter 6 Microlensing II: Beyond the simplest light curve 125 -- 6.1 Binary lenses126 -- 6.1.1 The complex lens equation126 -- 6.1.2 Microlensing by binaries131 -- 6.1.3 Planetary searches136 -- 6.2 Further determinations of the lensing parameters139 -- 6.2.1 Proper motion141 -- 6.2.2 Limb darkening147 -- 6.2.3 Parallax measurements148 -- 6.3 Astrometric microlensing152 -- 6.4 Quasar microlensing156 -- Appendix A Cosmology tools 161 -- A.1 The Friedmann-Robertson-Walker Universe161 -- A.2 The distance scales163 -- A.3 Large scale structures166 -- A.4 Cosmic Microwave Background anisotropies170 -- Bibliography 175 -- Index 189.…”
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783
Characterization of tribological materials
Published 2013Table of Contents: “…Surface analysis of precision ball bearings -- 8.1 Introduction -- 8.2 Disassembly -- Examination, optical microscopy, and photography -- Gas analysis by mass spectrometry -- Lubricant analysis and removal -- 8.3 Microexamination -- Scanning electron microscopy -- Profilometry -- 8.4 Surface analysis -- Auger electron spectroscopy -- Photoelectron spectroscopy -- SIMS -- Vibrational spectroscopy -- 8.5 Future directions -- Acknowledgments -- References --…”
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784
Characterization of tribological materials
Published 2013Table of Contents: “…Surface analysis of precision ball bearings -- 8.1 Introduction -- 8.2 Disassembly -- Examination, optical microscopy, and photography -- Gas analysis by mass spectrometry -- Lubricant analysis and removal -- 8.3 Microexamination -- Scanning electron microscopy -- Profilometry -- 8.4 Surface analysis -- Auger electron spectroscopy -- Photoelectron spectroscopy -- SIMS -- Vibrational spectroscopy -- 8.5 Future directions -- Acknowledgments -- References --…”
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785
Merritt's neurology.
Published 2010Table of Contents: “…Head injury -- Spine injury -- Cranial and peripheral nerve lesions -- Complex regional pain syndrome -- Radiation injury -- Electrical and lightning injury -- Decompression sickness -- Intervertebral dics and radiculopathy -- Cervical spondylotic myelopathy -- Thoracic outlet syndrome -- Hereditary and acquired spastic paraplegia -- Syringomyelia -- Neonatal neurology -- Floppy infant syndrome -- Disorders of motor and mental development -- Autism spectrum disorders -- Laurence-Moon-Biedl syndrome -- Cerebral and spinal malformations -- Chromosomal diseases -- Marcus Gunn -- Möbius syndrome -- Disorders of amino acid metabolism -- Disorders of purine and pyrimidine metabolism -- Lysosomal and other storage diseases -- Disorders of carbohydrate metabolism -- Glucose transporter type 1 deficiency syndrome -- Disorders of DNA maintenance, transcription, and translation -- Hyperammonemia -- Peroxisomal diseases: adrenoleukodystrophy, zellweger syndrome, and refsum disease -- Organic acidurias -- Disorders of metal metabolism -- Acute intermittent porphyria -- Neurologic syndromes with acanthocytes -- Cerebral degenerations of childhood -- Diffuse sclerosis and vanishing white matter disease -- Mitochondrial encephalomyopathies: diseases of mitochondrial DNA -- Leber hereditary optic neuropathy -- Mitochondrial diseases with mutations of nuclear DNA -- Neurofibromatosis -- Tuberous sclerosis complex -- Encephalotrigeminal angiomatosis -- Incontinentia pigmenti -- General considerations -- Alzheimer disease -- Frontotemporal dementia -- Lewy body dementias -- Huntington disease -- Choreas -- Myoclonus -- Gilles de la tourette syndrome -- Dystonia -- Essential tremor -- Parkinson disease -- Parkinson-plus syndromes -- Paroxysmal dyskinesias -- Tradive dyskinesia and other neuroleptic-induced syndromes -- Autosomal recessive ataxias -- Autosomal dominant ataxias -- Amyotrophic lateral sclerosis, progressive muscular atrophy, and primary lateral sclerosis -- Kennedy disease -- Spinal muscular atrophies of childhood -- Monomelic muscular atrophy -- General considerations -- The inherited peripheral neuropathies -- Acquired neuropathies -- Neuropathic pain -- Myasthenia gravis -- Lambert-Eaton syndrome -- Botulism and antibiotic-induced neuromuscular disorders -- Critical illness myopathy and neuropathy -- Identifying disorders of the motor unit --…”
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786
Merritt's neurology.
Published 2010Table of Contents: “…Head injury -- Spine injury -- Cranial and peripheral nerve lesions -- Complex regional pain syndrome -- Radiation injury -- Electrical and lightning injury -- Decompression sickness -- Intervertebral dics and radiculopathy -- Cervical spondylotic myelopathy -- Thoracic outlet syndrome -- Hereditary and acquired spastic paraplegia -- Syringomyelia -- Neonatal neurology -- Floppy infant syndrome -- Disorders of motor and mental development -- Autism spectrum disorders -- Laurence-Moon-Biedl syndrome -- Cerebral and spinal malformations -- Chromosomal diseases -- Marcus Gunn -- Möbius syndrome -- Disorders of amino acid metabolism -- Disorders of purine and pyrimidine metabolism -- Lysosomal and other storage diseases -- Disorders of carbohydrate metabolism -- Glucose transporter type 1 deficiency syndrome -- Disorders of DNA maintenance, transcription, and translation -- Hyperammonemia -- Peroxisomal diseases: adrenoleukodystrophy, zellweger syndrome, and refsum disease -- Organic acidurias -- Disorders of metal metabolism -- Acute intermittent porphyria -- Neurologic syndromes with acanthocytes -- Cerebral degenerations of childhood -- Diffuse sclerosis and vanishing white matter disease -- Mitochondrial encephalomyopathies: diseases of mitochondrial DNA -- Leber hereditary optic neuropathy -- Mitochondrial diseases with mutations of nuclear DNA -- Neurofibromatosis -- Tuberous sclerosis complex -- Encephalotrigeminal angiomatosis -- Incontinentia pigmenti -- General considerations -- Alzheimer disease -- Frontotemporal dementia -- Lewy body dementias -- Huntington disease -- Choreas -- Myoclonus -- Gilles de la tourette syndrome -- Dystonia -- Essential tremor -- Parkinson disease -- Parkinson-plus syndromes -- Paroxysmal dyskinesias -- Tradive dyskinesia and other neuroleptic-induced syndromes -- Autosomal recessive ataxias -- Autosomal dominant ataxias -- Amyotrophic lateral sclerosis, progressive muscular atrophy, and primary lateral sclerosis -- Kennedy disease -- Spinal muscular atrophies of childhood -- Monomelic muscular atrophy -- General considerations -- The inherited peripheral neuropathies -- Acquired neuropathies -- Neuropathic pain -- Myasthenia gravis -- Lambert-Eaton syndrome -- Botulism and antibiotic-induced neuromuscular disorders -- Critical illness myopathy and neuropathy -- Identifying disorders of the motor unit --…”
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787
Spin-crossover materials properties and applications /
Published 2013Table of Contents: “…Quintero, G´abor Molnar, Lionel Salmon and Azzedine Bousseksou 13.1 General Introduction 347 13.2 Introduction to Luminescent Materials and Luminescence Energy Transfer 348 13.3 Electronic Transitions and Optical Properties of Spin-Crossover Complexes 358 13.4 Materials with Combined Spin-Crossover and Luminescent Functionalities 361 13.5 Concluding Remarks 371 14 Nanoparticles, Thin Films and Surface Patterns from Spin-Crossover Materials and Electrical Spin State Control 375 Paulo Nuno Martinho, Cyril Rajnak and Mario Ruben 14.1 Introduction 375 14.2 Nanoparticles and Nanocrystals 376 14.3 Thin Films 387 14.4 Surface Patterns 393 14.5 Electrical Spin State Control 396 14.6 Conclusion 399 15 Ultrafast Studies of the Light-Induced Spin Change in Fe(II)-Polypyridine Complexes 405 Majed Chergui 15.1 Introduction 405 15.2 Properties of Fe(II) Complexes 406 15.3 From the Singlet to the Quintet State 408 15.4 Ultrafast X-Ray Studies 415 15.5 Summary and Outlook 417 16 Real-Time Observation of Spin-Transitions by Optical Microscopy 425 Francois Varret, Ahmed Slimani, Damien Garrot, Yann Garcia and Anil D. …”
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788
Spin-crossover materials properties and applications /
Published 2013Table of Contents: “…Quintero, G´abor Molnar, Lionel Salmon and Azzedine Bousseksou 13.1 General Introduction 347 13.2 Introduction to Luminescent Materials and Luminescence Energy Transfer 348 13.3 Electronic Transitions and Optical Properties of Spin-Crossover Complexes 358 13.4 Materials with Combined Spin-Crossover and Luminescent Functionalities 361 13.5 Concluding Remarks 371 14 Nanoparticles, Thin Films and Surface Patterns from Spin-Crossover Materials and Electrical Spin State Control 375 Paulo Nuno Martinho, Cyril Rajnak and Mario Ruben 14.1 Introduction 375 14.2 Nanoparticles and Nanocrystals 376 14.3 Thin Films 387 14.4 Surface Patterns 393 14.5 Electrical Spin State Control 396 14.6 Conclusion 399 15 Ultrafast Studies of the Light-Induced Spin Change in Fe(II)-Polypyridine Complexes 405 Majed Chergui 15.1 Introduction 405 15.2 Properties of Fe(II) Complexes 406 15.3 From the Singlet to the Quintet State 408 15.4 Ultrafast X-Ray Studies 415 15.5 Summary and Outlook 417 16 Real-Time Observation of Spin-Transitions by Optical Microscopy 425 Francois Varret, Ahmed Slimani, Damien Garrot, Yann Garcia and Anil D. …”
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789
Hermeticity testing of MEMS and microelectronic packages /
Published 2013Table of Contents: “…Machine generated contents note: References -- pt. 1 Introduction to Hermetic Packages and Leak Types -- 1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1.Introduction -- 1.2.The Evolution of Microelectronics and MEMS Packages -- 1.3.MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1.Materials -- 1.3.2.Sealing Techniques -- 1.4.Summary of MEMS Packaging Materials and Techniques -- References -- 2.Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1.Introduction -- 2.2.Particle Contamination -- 2.3.Thermomechanical Constraints -- 2.3.1.Thermomechanical Constraints in Die Attach -- 2.3.2.Thermomechanical Constraints in Package-Level Encapsulation -- 2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation -- 2.3.4.Thermomechanical Constraints in Flip-Chip Bonding -- 2.4.Moisture and Gas Absorption -- 2.4.1.Moisture Absorption -- 2.4.2.Barrier Coatings: A Protection Against Moisture Absorption -- 2.4.3.Outgassing -- 2.5.Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity -- 3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging -- 3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package -- References -- 4.The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1.Introduction -- 4.2.Leak Channels or Capillary Leaks -- 4.3.Permeation -- 4.4.Outgassing -- 4.5.Conclusion -- References -- pt. 2 Traditional Hermeticity Test Techniques and Standards -- 5.Ex Situ Hermeticity Test Methods -- 5.1.Introduction -- 5.2.Fine Leak Tests -- 5.2.1.Helium Fine Leak Test -- 5.2.2.Radioisotope Leak Detection Method -- 5.3.Gross Leak Tests -- 5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2.Gross Bubble Test -- 5.3.3.Weight Gain -- 5.3.4.Dye Penetrant Gross Leak Test -- 5.4.Combinational Tests -- 5.4.1.Optical Fine/Gross Leak Detection Method -- 5.4.2.Cumulative Helium Leak Detection (CHLD) Method -- References -- 6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1.Introduction: The First Hermeticity Tests -- 6.2.The Introduction of the Military Standards -- 6.3.The First Problems with Traditional Hermeticity Tests and Standards -- 6.4.Military Standard Revisions -- 6.5.Summary -- References -- pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7.Permeation -- 7.1.Introduction -- 7.2.Mathematics of Permeation -- 7.3.Limitations of the Packaging Material -- 7.4.Conclusions -- References -- 8.Outgassing and Residual Gas Analysis (RGA) -- 8.1.Outgassing -- 8.2.Residual Gas Analysis -- References -- 9.Low-Cavity Volume Capillary Leak Limitations -- 9.1.Limitations of the Helium Fine Leak Test Method -- 9.1.1.Volume Limitations -- 9.1.2.Minimum Detectable Leak Rate -- References -- pt. 4 Novel Methods of Leak Detection -- 10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1.Introduction -- 10.2.Lumped Element Modeling of a Microresonator -- 10.3.Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1.Definition in Terms of Stored Energy -- 10.3.2.Definition in Terms of Bandwidth -- 10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4.Determination of the Q-Factor by Phase Measurement -- 10.4.Relation Between Pressure and Q-Factor -- References -- 11.In Situ Test Methods in Development -- 11.1.Introduction -- 11.2.Copper Test Structures -- 11.3.Micro-Pirani Gauge -- References -- 12.Ex Situ Hermeticity Test Methods in Development -- 12.1.Introduction -- 12.2.FTIR Spectroscopy -- 12.2.1.Application to Hermeticity -- 12.2.2.Theoretical Limitations -- 12.2.3.Practical Considerations -- 12.2.4.Summary -- 12.3.Raman Spectroscopy -- 12.3.1.Application to the Hermeticity Test -- 12.3.2.Theoretical Limitations -- 12.3.3.Practical Considerations -- 12.3.4.Summary -- References -- pt. 5 Conclusions and Vision -- 13.Summary of Hermeticity Test Methods -- 14.The Way Forward -- 14.1.Introduction -- 14.2.Improvement on Existing Techniques -- 14.3.New Hermetic Materials and Hermeticity Test Methods -- 14.4.Conclusions -- References.…”
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790
Hermeticity testing of MEMS and microelectronic packages /
Published 2013Table of Contents: “…Machine generated contents note: References -- pt. 1 Introduction to Hermetic Packages and Leak Types -- 1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1.Introduction -- 1.2.The Evolution of Microelectronics and MEMS Packages -- 1.3.MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1.Materials -- 1.3.2.Sealing Techniques -- 1.4.Summary of MEMS Packaging Materials and Techniques -- References -- 2.Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1.Introduction -- 2.2.Particle Contamination -- 2.3.Thermomechanical Constraints -- 2.3.1.Thermomechanical Constraints in Die Attach -- 2.3.2.Thermomechanical Constraints in Package-Level Encapsulation -- 2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation -- 2.3.4.Thermomechanical Constraints in Flip-Chip Bonding -- 2.4.Moisture and Gas Absorption -- 2.4.1.Moisture Absorption -- 2.4.2.Barrier Coatings: A Protection Against Moisture Absorption -- 2.4.3.Outgassing -- 2.5.Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity -- 3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging -- 3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package -- References -- 4.The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1.Introduction -- 4.2.Leak Channels or Capillary Leaks -- 4.3.Permeation -- 4.4.Outgassing -- 4.5.Conclusion -- References -- pt. 2 Traditional Hermeticity Test Techniques and Standards -- 5.Ex Situ Hermeticity Test Methods -- 5.1.Introduction -- 5.2.Fine Leak Tests -- 5.2.1.Helium Fine Leak Test -- 5.2.2.Radioisotope Leak Detection Method -- 5.3.Gross Leak Tests -- 5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2.Gross Bubble Test -- 5.3.3.Weight Gain -- 5.3.4.Dye Penetrant Gross Leak Test -- 5.4.Combinational Tests -- 5.4.1.Optical Fine/Gross Leak Detection Method -- 5.4.2.Cumulative Helium Leak Detection (CHLD) Method -- References -- 6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1.Introduction: The First Hermeticity Tests -- 6.2.The Introduction of the Military Standards -- 6.3.The First Problems with Traditional Hermeticity Tests and Standards -- 6.4.Military Standard Revisions -- 6.5.Summary -- References -- pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7.Permeation -- 7.1.Introduction -- 7.2.Mathematics of Permeation -- 7.3.Limitations of the Packaging Material -- 7.4.Conclusions -- References -- 8.Outgassing and Residual Gas Analysis (RGA) -- 8.1.Outgassing -- 8.2.Residual Gas Analysis -- References -- 9.Low-Cavity Volume Capillary Leak Limitations -- 9.1.Limitations of the Helium Fine Leak Test Method -- 9.1.1.Volume Limitations -- 9.1.2.Minimum Detectable Leak Rate -- References -- pt. 4 Novel Methods of Leak Detection -- 10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1.Introduction -- 10.2.Lumped Element Modeling of a Microresonator -- 10.3.Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1.Definition in Terms of Stored Energy -- 10.3.2.Definition in Terms of Bandwidth -- 10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4.Determination of the Q-Factor by Phase Measurement -- 10.4.Relation Between Pressure and Q-Factor -- References -- 11.In Situ Test Methods in Development -- 11.1.Introduction -- 11.2.Copper Test Structures -- 11.3.Micro-Pirani Gauge -- References -- 12.Ex Situ Hermeticity Test Methods in Development -- 12.1.Introduction -- 12.2.FTIR Spectroscopy -- 12.2.1.Application to Hermeticity -- 12.2.2.Theoretical Limitations -- 12.2.3.Practical Considerations -- 12.2.4.Summary -- 12.3.Raman Spectroscopy -- 12.3.1.Application to the Hermeticity Test -- 12.3.2.Theoretical Limitations -- 12.3.3.Practical Considerations -- 12.3.4.Summary -- References -- pt. 5 Conclusions and Vision -- 13.Summary of Hermeticity Test Methods -- 14.The Way Forward -- 14.1.Introduction -- 14.2.Improvement on Existing Techniques -- 14.3.New Hermetic Materials and Hermeticity Test Methods -- 14.4.Conclusions -- References.…”
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791
Aerospace sensors
Published 2013Table of Contents: “…Gyroscopic devices and sensors -- 6.1 Introduction -- 6.1.1 Preliminary remarks -- 6.1.2 Classification of gyros -- 6.1.3 Gyroscopic instruments -- 6.1.4 Positional gyros -- 6.1.5 The vertical (or horizontal) gyro -- 6.1.6 Orbit gyro -- 6.1.7 Single degree of freedom (SDF) gyros -- 6.1.8 Gyro stabilizers -- 6.1.9 Gyroscopic instruments in aeronavigation -- 6.1.10 Inertial navigation systems (INS) -- 6.1.10.1 Types of INS -- 6.1.10.2 Strapdown INS -- 6.1.11 The scope of gyros and gyro instruments of various types -- 6.2 Single degree of freedom (SDF) gyros -- 6.2.1 The solid rotor SDF gyro -- 6.2.2 The integrating gyro -- 6.2.3 Rate of speed gauging -- 6.2.3.1 Feedback contours of the angular rate gauge -- 6.2.3.2 Design variants -- 6.3 The TDF gyro in gimbal mountings -- 6.3.1 Properties of a free gyro -- 6.3.2 Areas of application, design features, and error sources -- 6.3.3 Two-component angular speed measuring instruments -- 6.4 The gyroscopic integrator for linear acceleration (GILA) -- 6.4.1 Principles of GILA operation -- 6.4.2 Sources of GILA errors -- 6.5 Contactless suspension gyros -- 6.5.1 Introduction -- 6.5.2 The electrostatic gyroscope (ESG) -- 6.5.2.1 ESG accuracy -- 6.5.2.2 The ESG rotor -- 6.5.2.3 The rotor electrostatic suspension -- 6.5.2.4 Angular rotor position readout -- 6.5.3 Conclusion -- 6.6 The fiber optic gyro (FOG) -- 6.6.1 The interferometric fiber optic gyro (IFOG) -- 6.6.1.1 The basic IFOG scheme and the Sagnac effect -- 6.6.1.2 Open-loop operation -- 6.6.1.3 Closed-loop operation -- 6.6.1.4 Fundamental limitations -- 6.6.1.5 The multiple-axis IFOG -- 6.6.1.6 The depolarized IFOG -- 6.6.1.7 Applications of the IFOG -- 6.6.2 The resonator fiber optic gyro (RFOG) -- 6.7 The ring laser gyro (RLG) -- 6.7.1 Introduction -- 6.7.2 Principle of operation -- 6.7.3 Frequency characteristics and mode-locking counter-rotating waves -- 6.7.4 The elimination of mode-locking in counter-rotating waves -- 6.7.5 Errors -- 6.7.6 Performance and application -- 6.7.7 Conclusion -- 6.8 Dynamically tuned gyros (DTG) -- 6.8.1 Introduction -- 6.8.2 Key diagrams and dynamic tuning -- 6.8.3 Operating modes -- 6.8.4 Disturbance moments depending on external factors and instrumental errors -- 6.8.5 Magnetic, aerodynamic, and thermal disturbance moments -- 6.8.6 Design, application, technical characteristics -- 6.8.7 Conclusion -- 6.9 Solid vibrating gyros -- 6.9.1 Introduction -- 6.9.2 Dynamic behavior of the ideal solid vibrating gyro -- 6.9.3 Operating modes of the solid vibrating gyro -- 6.9.4 The nonideal solid vibrating gyro -- 6.9.5 Control of the solid vibrating gyro -- 6.9.6 Axisymmetric-shell gyros -- 6.9.7 The HRG, history and current status -- 6.9.8 HRG design characteristics -- 6.9.9 Additional HRG references -- 6.10 Micromechanical gyros -- 6.10.1 Introduction -- 6.10.2 Operating principles -- 6.10.2.1 Linear-linear (LL-type) gyros -- 6.10.2.2 Rotary-rotary (RR-type) gyro principles -- 6.10.2.3 Fork and rod gyro principles -- 6.10.2.4 Ring gyro principles -- 6.10.3 Adjustment of oscillation modes in gyros of the LL and RR types -- 6.10.4 Design, application, and performance -- 6.10.4.1 Gyros of the LL and RR-type -- 6.10.4.2 Fork and rod gyros -- 6.10.4.3 Ring gyros -- 6.10.5 Conclusion -- References --…”
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792
Aerospace sensors
Published 2013Table of Contents: “…Gyroscopic devices and sensors -- 6.1 Introduction -- 6.1.1 Preliminary remarks -- 6.1.2 Classification of gyros -- 6.1.3 Gyroscopic instruments -- 6.1.4 Positional gyros -- 6.1.5 The vertical (or horizontal) gyro -- 6.1.6 Orbit gyro -- 6.1.7 Single degree of freedom (SDF) gyros -- 6.1.8 Gyro stabilizers -- 6.1.9 Gyroscopic instruments in aeronavigation -- 6.1.10 Inertial navigation systems (INS) -- 6.1.10.1 Types of INS -- 6.1.10.2 Strapdown INS -- 6.1.11 The scope of gyros and gyro instruments of various types -- 6.2 Single degree of freedom (SDF) gyros -- 6.2.1 The solid rotor SDF gyro -- 6.2.2 The integrating gyro -- 6.2.3 Rate of speed gauging -- 6.2.3.1 Feedback contours of the angular rate gauge -- 6.2.3.2 Design variants -- 6.3 The TDF gyro in gimbal mountings -- 6.3.1 Properties of a free gyro -- 6.3.2 Areas of application, design features, and error sources -- 6.3.3 Two-component angular speed measuring instruments -- 6.4 The gyroscopic integrator for linear acceleration (GILA) -- 6.4.1 Principles of GILA operation -- 6.4.2 Sources of GILA errors -- 6.5 Contactless suspension gyros -- 6.5.1 Introduction -- 6.5.2 The electrostatic gyroscope (ESG) -- 6.5.2.1 ESG accuracy -- 6.5.2.2 The ESG rotor -- 6.5.2.3 The rotor electrostatic suspension -- 6.5.2.4 Angular rotor position readout -- 6.5.3 Conclusion -- 6.6 The fiber optic gyro (FOG) -- 6.6.1 The interferometric fiber optic gyro (IFOG) -- 6.6.1.1 The basic IFOG scheme and the Sagnac effect -- 6.6.1.2 Open-loop operation -- 6.6.1.3 Closed-loop operation -- 6.6.1.4 Fundamental limitations -- 6.6.1.5 The multiple-axis IFOG -- 6.6.1.6 The depolarized IFOG -- 6.6.1.7 Applications of the IFOG -- 6.6.2 The resonator fiber optic gyro (RFOG) -- 6.7 The ring laser gyro (RLG) -- 6.7.1 Introduction -- 6.7.2 Principle of operation -- 6.7.3 Frequency characteristics and mode-locking counter-rotating waves -- 6.7.4 The elimination of mode-locking in counter-rotating waves -- 6.7.5 Errors -- 6.7.6 Performance and application -- 6.7.7 Conclusion -- 6.8 Dynamically tuned gyros (DTG) -- 6.8.1 Introduction -- 6.8.2 Key diagrams and dynamic tuning -- 6.8.3 Operating modes -- 6.8.4 Disturbance moments depending on external factors and instrumental errors -- 6.8.5 Magnetic, aerodynamic, and thermal disturbance moments -- 6.8.6 Design, application, technical characteristics -- 6.8.7 Conclusion -- 6.9 Solid vibrating gyros -- 6.9.1 Introduction -- 6.9.2 Dynamic behavior of the ideal solid vibrating gyro -- 6.9.3 Operating modes of the solid vibrating gyro -- 6.9.4 The nonideal solid vibrating gyro -- 6.9.5 Control of the solid vibrating gyro -- 6.9.6 Axisymmetric-shell gyros -- 6.9.7 The HRG, history and current status -- 6.9.8 HRG design characteristics -- 6.9.9 Additional HRG references -- 6.10 Micromechanical gyros -- 6.10.1 Introduction -- 6.10.2 Operating principles -- 6.10.2.1 Linear-linear (LL-type) gyros -- 6.10.2.2 Rotary-rotary (RR-type) gyro principles -- 6.10.2.3 Fork and rod gyro principles -- 6.10.2.4 Ring gyro principles -- 6.10.3 Adjustment of oscillation modes in gyros of the LL and RR types -- 6.10.4 Design, application, and performance -- 6.10.4.1 Gyros of the LL and RR-type -- 6.10.4.2 Fork and rod gyros -- 6.10.4.3 Ring gyros -- 6.10.5 Conclusion -- References --…”
An electronic book accessible through the World Wide Web; click to view
Electronic eBook -
793
Guide to state-of-the-art electron devices
Published 2013Table of Contents: “…Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index.…”
An electronic book accessible through the World Wide Web; click to view
Electronic eBook -
794
Guide to state-of-the-art electron devices
Published 2013Table of Contents: “…Machine generated contents note: Foreword Preface Contributors and Acknowledgements Historic Timeline Part I - Basic Electron Devices 1 Bipolar Transistors 1.1 Motivation 1.2 The pn Junction and Its Electronic Applications 1.3 The Bipolar Junction Transistor and Its Electronic Applications 1.4 Optimization of Bipolar Transistors 1.5 SiGe Heterojunction Bipolar Transistors References 2 MOS Devices 2.1 Introduction 2.2 MOSFET Basics 2.3 The Evolution of MOSFET 2.4 Concluding Remarks References 3 Memory Devices 3.1 Introduction 3.2 Volatile Memories 3.3 Non-Volatile Memories 3.4 Future Perspectives of MOS Memories 3.5 Closing Remarks References 4 Passive Components 4.1 Discrete and integrated passive components 4.2 Application in Analog ICs and DRAM 4.3 The planar Spiral Inductor - A Case Study 4.4 Parasitics in Integrated Circuits References 5 Emerging Research Devices 5.1 Non-Charge Based Switching 5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics 5.3 Conclusions References Part II - Aspects of Device and IC Manufacturing 6 Electronics Materials 6.1 Introduction 6.2 Silicon Device Technology 6.3 Compound Semiconductor Devices 6.4 Electronic Displays 6.5 Conclusions References 7 Compact Modeling 7.1 The Role of Compact Models 7.2 Bipolar Transistor Compact Modeling 7.3 MOS Transistor Compact Modeling 7.4 Compact Modeling of Passive Components 7.5 Benchmarking and Implementation References 8 Technology Computer Aided Design 8.1 Introduction 8.2 Drift-Diffusion Model 8.3 Microscopic Transport Models 8.4 Quantum Transport Models 8.5 Process and Equipment Simulation References 9 Device Reliability Physics 9.1 Introduction and Background 9.2 Device Reliability Issues 9.3 Interconnect Degradation Mechanisms 9.4 Circuit-Level Reliability Issues 9.5 Microscopic Approaches to Assuring Reliability of ICs References 10 Semiconductor Manufacturing 10.1 Introduction 10.2 Substrates 10.3 Lithography and Etching 10.4 Front-End Processing 10.5 Back-End Processing 10.6 Process Control 10.7 Assembly and Test 10.8 Future Directions References Part III - Applications based on Electron Devices 11 VLSI Logic Technology and Circuits 11.1 Introduction 11.2 MOSFET Scaling Trends 11.3 Low-Power and High-Speed Logic Design 11.4 Scaling-Driven technology Enhancements 11.5 Ultra-Low Voltage Transistors 11.6 Interconnects 11.7 Memory Design 11.8 System Integration References 12 VLSI Mixed-Signal Technology And Circuits 12.1 Introduction 12.2 Analog/Mixed-Signal Technologies in Scaled CMOS 12.3 Data Converter ICs 12.4 Mixed-Signal Circuits in Low-Power Display Applications 12.5 Image Sensor Technology and Circuits References 13 Memory Technologies 13.1 Semiconductor Memory History 13.2 State of Mainstream Semiconductor Memory Today 13.3 Emerging Memory Technologies 13.4 Conclusions References 14 RF&Microwave Semiconductor Technologies 14.1 III-V Based: GaAs and InP 14.2 Si and SiGe 14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond) References 15 Power Devices and ICs 15.1 Overview of Power Devices & ICs 15.2 Two-Carrier and High-Power Devices 15.3 Power MOSFET Devices 15.4 High-Voltage and Power ICs 15.5 Wide Bandgap Power Devices References 16 Photovoltaic Device Applications 16.1 Introduction 16.2 Silicon Photovoltaics 16.3 Polycrystalline Thin-Film Photovoltaics 16.4 III-V Compound Photovoltaics 16.5 Future Concepts in Photovoltaics References 17 Large Area Electronics 17.1 Thin-Film Solar Cells 17.2 Large-Area Imaging 17.3 Flat-Panel Displays References 18 Microelectromechanical Systems (MEMS) 18.1 Introduction 18.2 The 1960's - First Micromachined Structures Envisioned 18.3 The 1970's - Integrated Sensors Started 18.4 The 1980's - Surface Micromachining Emerged 18.5 The 1990's - MEMS Impacted Various Fields 18.6 The 2000's - Diversified Sophisticated Systems Enabled By MEMS 18.7 Future Outlook References 19 Vacuum Device Applications 19.1 Traveling-Wave Devices 19.2 Klystrons 19.3 Inductive Output Tubes 19.4 Crossed-Field Devices 19.5 Gyro-Devices References 20 Optoelectronic Device Applications 20.1 Introduction 20.2 Light Emission in Semiconductors 20.3 Photodetectors 20.4 Integrated Optoelectronics 20.5 Optical Interconnects 20.6 Concluding Remarks References 21 Devices for the Post Silicon CMOS Era 21.1 Introduction 21.2 Devices for the 8-nm Node With Conventional Materials 21.3 New Channel Materials and Devices 21.4 Concluding Remarks References Index.…”
An electronic book accessible through the World Wide Web; click to view
Electronic eBook -
795
The science of color
Published 2003An electronic book accessible through the World Wide Web; click to view
Electronic eBook -
796
The science of color
Published 2003An electronic book accessible through the World Wide Web; click to view
Electronic eBook -
797
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