Ngā hua rapu - "WSPC series in advanced integration and packaging ;"

Ngā kaupapa kua whakahuatia i roto i tō rapu.
  • E whakaatu ana i te 1 - 2 hua o te 2
Whakamahine hua
  1. 1
    Ata uhi

    Design and modeling for 3D ICs and interposers / mā Swaminathan, Madhavan

    I whakaputaina 2014
    “…WSPC series in advanced integration and packaging ;…”
    An electronic book accessible through the World Wide Web; click to view
    Tāhiko īPukapuka

    Tiaki ki tētahi rārangi
    I tiakina i:
  2. 2
    Ata uhi

    Cost analysis of electronic systems mā Sandborn, Peter

    I whakaputaina 2013
    “…WSPC series in advanced integration and packaging ;…”
    An electronic book accessible through the World Wide Web; click to view
    Tāhiko īPukapuka

    Tiaki ki tētahi rārangi
    I tiakina i:

Ngā utauta rapu: