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  1. 1
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    Lead-free solder interconnect reliability

    出版 2005
    An electronic book accessible through the World Wide Web; click to view
    电子 电子书

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  2. 2
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    Portable consumer electronics packaging, materials, and reliability / 由 Canumalla, Sridhar

    出版 2010
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    电子 电子书

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  3. 3
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    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / 由 Liu, S. (Sheng), 1963-

    出版 2011
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    电子 电子书

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  4. 4
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    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    出版 2014
    An electronic book accessible through the World Wide Web; click to view
    电子 电子书

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  5. 5
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    Adhesion in microelectronics /

    出版 2014
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    电子 电子书

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    Microwave and millimeter-wave electronic packaging / 由 Sturdivant, Rick

    出版 2014
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    电子 电子书

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  7. 7
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    LCP for microwave packages and modules

    出版 2012
    An electronic book accessible through the World Wide Web; click to view
    电子 电子书

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