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Lead-free solder interconnect reliability

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Portable consumer electronics packaging, materials, and reliability / 著者: Canumalla, Sridhar

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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / 著者: Liu, S. (Sheng), 1963-

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Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

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Adhesion in microelectronics /

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Microwave and millimeter-wave electronic packaging / 著者: Sturdivant, Rick

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LCP for microwave packages and modules

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