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  1. 1
    Omslagsbillede

    Lead-free solder interconnect reliability

    Udgivet 2005
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  2. 2
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    Portable consumer electronics packaging, materials, and reliability / af Canumalla, Sridhar

    Udgivet 2010
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  3. 3
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    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / af Liu, S. (Sheng), 1963-

    Udgivet 2011
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  4. 4
    Omslagsbillede

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Udgivet 2014
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  5. 5
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    Adhesion in microelectronics /

    Udgivet 2014
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  6. 6
    Omslagsbillede

    Microwave and millimeter-wave electronic packaging / af Sturdivant, Rick

    Udgivet 2014
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  7. 7
    Omslagsbillede

    LCP for microwave packages and modules

    Udgivet 2012
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