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  • Gösterilen 1 - 6 sonuçlar arası kayıtlar. 6
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  1. 1
    Kapak Resmi

    Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, C...

    Baskı/Yayın Bilgisi 1990
    An electronic book accessible through the World Wide Web; click to view
    Elektronik Ekitap

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  2. 2
    Kapak Resmi

    Boundary-scan interconnect diagnosis Yazar: Sousa, José T. de

    Baskı/Yayın Bilgisi 2001
    An electronic book accessible through the World Wide Web; click to view
    Elektronik Ekitap

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  3. 3
    Kapak Resmi

    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Baskı/Yayın Bilgisi 2006
    An electronic book accessible through the World Wide Web; click to view
    Elektronik Ekitap

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  4. 4
    Kapak Resmi

    LED packaging for lighting applications design, manufacturing, and testing / Yazar: Liu, S. (Sheng), 1963-

    Baskı/Yayın Bilgisi 2011
    An electronic book accessible through the World Wide Web; click to view
    Elektronik Ekitap

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  5. 5
    Kapak Resmi

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Baskı/Yayın Bilgisi 2014
    An electronic book accessible through the World Wide Web; click to view
    Elektronik Ekitap

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  6. 6
    Kapak Resmi

    Semiconductor packaging materials interaction and reliability /

    Baskı/Yayın Bilgisi 2011
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    Elektronik Ekitap

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