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  1. 1
    Ata uhi

    Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, C...

    I whakaputaina 1990
    An electronic book accessible through the World Wide Web; click to view
    Tāhiko īPukapuka

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  2. 2
    Ata uhi

    Boundary-scan interconnect diagnosis mā Sousa, José T. de

    I whakaputaina 2001
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  3. 3
    Ata uhi

    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    I whakaputaina 2006
    An electronic book accessible through the World Wide Web; click to view
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  4. 4
    Ata uhi

    LED packaging for lighting applications design, manufacturing, and testing / mā Liu, S. (Sheng), 1963-

    I whakaputaina 2011
    An electronic book accessible through the World Wide Web; click to view
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  5. 5
    Ata uhi

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    I whakaputaina 2014
    An electronic book accessible through the World Wide Web; click to view
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  6. 6
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    Semiconductor packaging materials interaction and reliability /

    I whakaputaina 2011
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