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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, C...

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Boundary-scan interconnect diagnosis 著者: Sousa, José T. de

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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

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LED packaging for lighting applications design, manufacturing, and testing / 著者: Liu, S. (Sheng), 1963-

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Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

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Semiconductor packaging materials interaction and reliability /

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