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  1. 1

    Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, C...

    Έκδοση 1990
    An electronic book accessible through the World Wide Web; click to view
    Ηλεκτρονική πηγή Ηλ. βιβλίο
  2. 2

    Boundary-scan interconnect diagnosis από Sousa, José T. de

    Έκδοση 2001
    An electronic book accessible through the World Wide Web; click to view
    Ηλεκτρονική πηγή Ηλ. βιβλίο
  3. 3

    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Έκδοση 2006
    An electronic book accessible through the World Wide Web; click to view
    Ηλεκτρονική πηγή Ηλ. βιβλίο
  4. 4

    LED packaging for lighting applications design, manufacturing, and testing / από Liu, S. (Sheng), 1963-

    Έκδοση 2011
    An electronic book accessible through the World Wide Web; click to view
    Ηλεκτρονική πηγή Ηλ. βιβλίο
  5. 5

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Έκδοση 2014
    An electronic book accessible through the World Wide Web; click to view
    Ηλεκτρονική πηγή Ηλ. βιβλίο
  6. 6

    Semiconductor packaging materials interaction and reliability /

    Έκδοση 2011
    Click to View
    Ηλεκτρονική πηγή Ηλ. βιβλίο