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  1. 1
    Omslagsbillede

    Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, C...

    Udgivet 1990
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  2. 2
    Omslagsbillede

    Boundary-scan interconnect diagnosis af Sousa, José T. de

    Udgivet 2001
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  3. 3
    Omslagsbillede

    Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

    Udgivet 2006
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  4. 4
    Omslagsbillede

    LED packaging for lighting applications design, manufacturing, and testing / af Liu, S. (Sheng), 1963-

    Udgivet 2011
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  5. 5
    Omslagsbillede

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Udgivet 2014
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  6. 6
    Omslagsbillede

    Semiconductor packaging materials interaction and reliability /

    Udgivet 2011
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