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  1. 1
    Lead-free solder interconnect reliability

    Lead-free solder interconnect reliability

    Published 2005
    An electronic book accessible through the World Wide Web; click to view
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  2. 2
    Portable consumer electronics packaging, materials, and reliability /

    Portable consumer electronics packaging, materials, and reliability / by Canumalla, Sridhar

    Published 2010
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  3. 3
    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / by Liu, S. (Sheng), 1963-

    Published 2011
    An electronic book accessible through the World Wide Web; click to view
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  4. 4
    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Published 2014
    An electronic book accessible through the World Wide Web; click to view
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  5. 5
    Adhesion in microelectronics /

    Adhesion in microelectronics /

    Published 2014
    An electronic book accessible through the World Wide Web; click to view
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  6. 6
    Microwave and millimeter-wave electronic packaging /

    Microwave and millimeter-wave electronic packaging / by Sturdivant, Rick

    Published 2014
    An electronic book accessible through the World Wide Web; click to view
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  7. 7
    Lead-free solder interconnect reliability

    Lead-free solder interconnect reliability

    Published 2005
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
    Save to List
    Saved in:
  8. 8
    Portable consumer electronics packaging, materials, and reliability /

    Portable consumer electronics packaging, materials, and reliability / by Canumalla, Sridhar

    Published 2010
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
    Save to List
    Saved in:
  9. 9
    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

    Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing / by Liu, S. (Sheng), 1963-

    Published 2011
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
    Save to List
    Saved in:
  10. 10
    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

    Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT...

    Published 2014
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
    Save to List
    Saved in:
  11. 11
    Adhesion in microelectronics /

    Adhesion in microelectronics /

    Published 2014
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
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  12. 12
    Microwave and millimeter-wave electronic packaging /

    Microwave and millimeter-wave electronic packaging / by Sturdivant, Rick

    Published 2014
    An electronic book accessible through the World Wide Web; click to view
    Electronic eBook
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  13. 13
    LCP for microwave packages and modules

    LCP for microwave packages and modules

    Published 2012
    An electronic book accessible through the World Wide Web; click to view
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  14. 14
    LCP for microwave packages and modules

    LCP for microwave packages and modules

    Published 2012
    An electronic book accessible through the World Wide Web; click to view
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