Microwave and millimeter-wave electronic packaging /
Saved in:
Main Author: | Sturdivant, Rick (Author) |
---|---|
Format: | Electronic eBook |
Language: | English |
Published: |
Boston, [Massachusetts] ; London, [England] :
Artech House,
2014.
|
Series: | Artech House microwave library.
|
Subjects: | |
Online Access: | An electronic book accessible through the World Wide Web; click to view |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
by: Liu, S. (Sheng), 1963-
Published: (2011) -
Portable consumer electronics packaging, materials, and reliability /
by: Canumalla, Sridhar
Published: (2010) -
Adhesion in microelectronics /
Published: (2014) -
Lead-free solder interconnect reliability
Published: (2005) -
Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Published: (1990)