Design and modeling for 3D ICs and interposers /
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| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
| Series: | WSPC series in advanced integration and packaging ;
v. 2. |
| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
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Design and modeling for 3D ICs and interposers /
Published 2014
An electronic book accessible through the World Wide Web; click to view
Electronic
eBook