Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Saved in:
| 主要作者: | |
|---|---|
| 企业作者: | |
| 其他作者: | |
| 格式: | 电子 电子书 |
| 语言: | 英语 |
| 出版: |
Hoboken, N.J. :
Wiley,
2011.
|
| 主题: | |
| 在线阅读: | An electronic book accessible through the World Wide Web; click to view |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|