Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Bibliografske podrobnosti

Glavni avtor:	Liu, S. (Sheng), 1963-
Korporativna značnica:	ebrary, Inc
Drugi avtorji:	Liu, Yong, 1962-
Format:	Elektronski eKnjiga
Jezik:	angleščina
Izdano:	Hoboken, N.J. : Wiley, 2011.
Teme:	Microelectronic packaging > Simulation methods. Electronic books.
Online dostop:	An electronic book accessible through the World Wide Web; click to view
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