Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Detalles Bibliográficos

Autor principal:	Liu, S. (Sheng), 1963-
Autor Corporativo:	ebrary, Inc
Otros Autores:	Liu, Yong, 1962-
Formato:	Electrónico eBook
Lenguaje:	inglés
Publicado:	Hoboken, N.J. : Wiley, 2011.
Materias:	Microelectronic packaging > Simulation methods. Electronic books.
Acceso en línea:	An electronic book accessible through the World Wide Web; click to view
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!