Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Збережено в:
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| Співавтор: | |
| Інші автори: | |
| Формат: | Електронний ресурс eКнига |
| Мова: | Англійська |
| Опубліковано: |
Hoboken, N.J. :
Wiley,
2011.
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| Предмети: | |
| Онлайн доступ: | An electronic book accessible through the World Wide Web; click to view |
| Теги: |
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Зміст:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.