Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
-д хадгалсан:
| Үндсэн зохиолч: | |
|---|---|
| Байгууллагын зохиогч: | |
| Бусад зохиолчид: | |
| Формат: | Цахим Цахим ном |
| Хэл сонгох: | англи |
| Хэвлэсэн: |
Hoboken, N.J. :
Wiley,
2011.
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| Нөхцлүүд: | |
| Онлайн хандалт: | An electronic book accessible through the World Wide Web; click to view |
| Шошгууд: |
Шошго нэмэх
Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!
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Агуулга:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.