Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Gorde:
| Egile nagusia: | |
|---|---|
| Erakunde egilea: | |
| Beste egile batzuk: | |
| Formatua: | Baliabide elektronikoa eBook |
| Hizkuntza: | ingelesa |
| Argitaratua: |
Hoboken, N.J. :
Wiley,
2011.
|
| Gaiak: | |
| Sarrera elektronikoa: | An electronic book accessible through the World Wide Web; click to view |
| Etiketak: |
Etiketa erantsi
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
|
Aurkibidea:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.