Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| 格式: | 电子 电子书 |
| 语言: | 英语 |
| 出版: |
Hoboken, N.J. :
Wiley,
2011.
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| 在线阅读: | An electronic book accessible through the World Wide Web; click to view |
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