Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Shranjeno v:
| Glavni avtor: | |
|---|---|
| Korporativna značnica: | |
| Drugi avtorji: | |
| Format: | Elektronski eKnjiga |
| Jezik: | angleščina |
| Izdano: |
Hoboken, N.J. :
Wiley,
2011.
|
| Teme: | |
| Online dostop: | An electronic book accessible through the World Wide Web; click to view |
| Oznake: |
Označite
Brez oznak, prvi označite!
|
Podobne knjige/članki
Microwave and millimeter-wave electronic packaging /
od: Sturdivant, Rick
Izdano: (2014)
od: Sturdivant, Rick
Izdano: (2014)
Adhesion in microelectronics /
Izdano: (2014)
Izdano: (2014)
Portable consumer electronics packaging, materials, and reliability /
od: Canumalla, Sridhar
Izdano: (2010)
od: Canumalla, Sridhar
Izdano: (2010)
Lead-free solder interconnect reliability
Izdano: (2005)
Izdano: (2005)
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Izdano: (2006)
Izdano: (2006)
Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Izdano: (1990)
Izdano: (1990)
Hermeticity testing of MEMS and microelectronic packages /
od: Costello, Suzanne, et al.
Izdano: (2013)
od: Costello, Suzanne, et al.
Izdano: (2013)
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Izdano: (2014)
Izdano: (2014)
LED packaging for lighting applications design, manufacturing, and testing /
od: Liu, S. (Sheng), 1963-
Izdano: (2011)
od: Liu, S. (Sheng), 1963-
Izdano: (2011)
LCP for microwave packages and modules
Izdano: (2012)
Izdano: (2012)
Boundary-scan interconnect diagnosis
od: Sousa, José T. de
Izdano: (2001)
od: Sousa, José T. de
Izdano: (2001)
Chemistry in microelectronics
Izdano: (2013)
Izdano: (2013)
Understanding microelectronics a top-down approach /
od: Maloberti, F. (Franco)
Izdano: (2012)
od: Maloberti, F. (Franco)
Izdano: (2012)
Packaging technology fundamentals, materials and processes /
Izdano: (2012)
Izdano: (2012)
Future Trends in Microelectronics frontiers and innovations /
Izdano: (2013)
Izdano: (2013)
Rigid plastics packaging materials, processes and applications /
od: Hannay, F.
Izdano: (2002)
od: Hannay, F.
Izdano: (2002)
Advances in meat, poultry and seafood packaging
Izdano: (2012)
Izdano: (2012)
Packaging essentials 100 design principles for creating packages /
od: Roncarelli, Sarah
Izdano: (2010)
od: Roncarelli, Sarah
Izdano: (2010)
Microelectronics, microsystems and nanotechnology papers presented at MMN 2000, Athens, Greece, 20-22 November 2000 /
Izdano: (2001)
Izdano: (2001)
Selecting colour for packaging /
od: Danger, Eric P. (Eric Paxton)
Izdano: (1987)
od: Danger, Eric P. (Eric Paxton)
Izdano: (1987)
Modeling and simulation in manufacturing and defense acquisition pathways to success /
Izdano: (2002)
Izdano: (2002)
Research on food packaging technology : selected, peer reviewed papers from the 2013 China Academic Conference on Food Packaging, November 23-25, 2013, Tianjin, China /
Izdano: (2014)
Izdano: (2014)
Packaging for nonthermal processing of food
Izdano: (2007)
Izdano: (2007)
Biopharmaceutics modeling and simulations theory, practice, methods, and applications /
od: Sugano, Kiyohiko
Izdano: (2012)
od: Sugano, Kiyohiko
Izdano: (2012)
Emerging food packaging technologies principles and practice /
Izdano: (2012)
Izdano: (2012)
Solar module packaging polymeric requirements and selection /
od: Poliskie, Michelle
Izdano: (2011)
od: Poliskie, Michelle
Izdano: (2011)
System modeling and simulation
od: Singh, V. P.
Izdano: (2009)
od: Singh, V. P.
Izdano: (2009)
Semiconductor packaging materials interaction and reliability /
Izdano: (2011)
Izdano: (2011)
Nanoparticles in active polymer food packaging /
od: Hrnjak Murgić, Zlata
Izdano: (2015)
od: Hrnjak Murgić, Zlata
Izdano: (2015)
Assessing food safety of polymer packaging
od: Vergnaud, J. M.
Izdano: (2006)
od: Vergnaud, J. M.
Izdano: (2006)
Green printing and packaging materials : selected, peer-reviewed papers from the 2011 China Academic Conference on Green Printing and Packaging Materials, August 20-23, 2011, Harbin China /
Izdano: (2012)
Izdano: (2012)
Future trends in microelectronics : Journey into the unknown /
Izdano: (2016)
Izdano: (2016)
Behavioral modeling and simulation from individuals to societies /
Izdano: (2008)
Izdano: (2008)
Regulation of food packaging in Europe and the USA
od: Knight, Derek J.
Izdano: (2004)
od: Knight, Derek J.
Izdano: (2004)
Plastic films in food packaging materials, technology, and applications /
Izdano: (2013)
Izdano: (2013)
Handbook of paper and paperboard packaging technology
Izdano: (2013)
Izdano: (2013)