Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Zapisane w:
| 1. autor: | |
|---|---|
| Korporacja: | |
| Kolejni autorzy: | |
| Format: | Elektroniczne E-book |
| Język: | angielski |
| Wydane: |
Hoboken, N.J. :
Wiley,
2011.
|
| Hasła przedmiotowe: | |
| Dostęp online: | An electronic book accessible through the World Wide Web; click to view |
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