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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

-д хадгалсан:

Номзүйн дэлгэрэнгүй
Үндсэн зохиолч:	Liu, S. (Sheng), 1963-
Байгууллагын зохиогч:	ebrary, Inc
Бусад зохиолчид:	Liu, Yong, 1962-
Формат:	Цахим Цахим ном
Хэл сонгох:	англи
Хэвлэсэн:	Hoboken, N.J. : Wiley, 2011.
Нөхцлүүд:	Microelectronic packaging > Simulation methods. Electronic books.
Онлайн хандалт:	An electronic book accessible through the World Wide Web; click to view
Шошгууд:	Шошго нэмэх Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!

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