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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

I tiakina i:

Ngā taipitopito rārangi puna kōrero
Kaituhi matua:	Liu, S. (Sheng), 1963-
Kaituhi rangatōpū:	ebrary, Inc
Ētahi atu kaituhi:	Liu, Yong, 1962-
Hōputu:	Tāhiko īPukapuka
Reo:	Ingarihi
I whakaputaina:	Hoboken, N.J. : Wiley, 2011.
Ngā marau:	Microelectronic packaging > Simulation methods. Electronic books.
Urunga tuihono:	An electronic book accessible through the World Wide Web; click to view
Ngā Tūtohu:	Tāpirihia he Tūtohu Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!

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