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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

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Podrobná bibliografie
Hlavní autor:	Liu, S. (Sheng), 1963-
Korporativní autor:	ebrary, Inc
Další autoři:	Liu, Yong, 1962-
Médium:	Elektronický zdroj E-kniha
Jazyk:	angličtina
Vydáno:	Hoboken, N.J. : Wiley, 2011.
Témata:	Microelectronic packaging > Simulation methods. Electronic books.
On-line přístup:	An electronic book accessible through the World Wide Web; click to view
Tagy:	Přidat tag Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!

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